•Small and light weight design

•Thin film manufacturing method stabilizing fusing characteristics

•Low internal resistance

•Suitable for over current protection

•Recognized standard:UL248-14 file No. E241710

Application

•PC related equipment and peripherals(PC, Hard Drive, ODD, Printer etc.

•Small portable devices, mobile phone,PDA, battery charger etc.

•Digital camera

•Game equipment

•LCD monitors, LCD modules (Backlight inverter)

•Battery package

Features

•Ultra low capacitance

•Ultra-low leakage current

•Zero signal distortion

•Fast response time

•Bi-direction protection device

Application

•Mobile / smart phone

•Computers / N/B PC

•Digital cameras

•PDA / MID / UMPC

•Plasma display panel / LCD TV / HDTV / PDP

•MP3 / Multimedia players / Game device

•Scanner / Printer

•Ultra-high speed data ports USB 3.0, IEEE1394, DVI, HDMI, High speed Ethernet

Features

•High precision and various resistances and B values

•Excellent solderability

•High stability

•RoHS Compliant

•Good stability of resistance value after soldering

•Multilayer SMD NTC with inner electrodes

Application

•Battery packs

•Mobile phones

•Motherboard

•Blood glucose meter

•Electronic thermometer

•Heated humidifier

•Air conditioner

•Emperature controller